Rakon推出了集成電路OCXO產(chǎn)品ROM1490X
Rakon推出適用于云數(shù)據(jù)中心和下一代電信網(wǎng)絡(luò)的8小時(shí)緩發(fā)小型IC-OCXO
Rakon推出了集成電路OCXO產(chǎn)品，結(jié)合了其內(nèi)部設(shè)計(jì)的Mercury半導(dǎo)體芯片和XMEMS®MercuryX品牌的諧振器。MercuryX OCXO晶振提供了超高的穩(wěn)定性和8小時(shí)的延長(zhǎng)保持時(shí)間。在現(xiàn)實(shí)條件下，所有產(chǎn)品均采用小尺寸封裝。新型OCXOs非常適合人工智能計(jì)算/數(shù)據(jù)中心、5G、5G Advanced和6G電信網(wǎng)絡(luò)以及衛(wèi)星終端和儀器儀表的計(jì)時(shí)和同步。Rakon產(chǎn)品管理主管Reza Sedehi表示:“MercuryX產(chǎn)品展示了下一代石英技術(shù)（如XMEMS）可能帶來的性能提升。1000多個(gè)MercuryX樣品引起了一級(jí)客戶的高度興趣和積極反饋。新產(chǎn)品建立在十多年來持續(xù)大批量提供高質(zhì)量基于ASIC的ocxo（IC-ocxo）的成功記錄基礎(chǔ)上。”MercuryX之前推出了Niku，這是Rakon晶振公司的內(nèi)部設(shè)計(jì)的用于超穩(wěn)定TCXOs的ASIC半導(dǎo)體芯片，是該公司人工智能計(jì)算產(chǎn)品組合的下一款產(chǎn)品。新的MercuryX OCXOs在穩(wěn)定性（1.5 ppb）、頻率斜率（0.05 ppb/°C）和老化（0.2 ppb/天）方面比當(dāng)前的IC-OCXO系列性能提高了三倍。更重要的是，MercuryX滿足了數(shù)據(jù)中心和電信網(wǎng)絡(luò)備受追捧的延期要求（8小時(shí)）。 
開發(fā)自己的內(nèi)部諧振器和芯片技術(shù)使Rakon能夠控制其產(chǎn)品路線圖，創(chuàng)造出像MercuryX這樣的市場(chǎng)產(chǎn)品，這些產(chǎn)品在其新西蘭和印度的工廠中獨(dú)立生產(chǎn)，為客戶提供了高度的供應(yīng)保障。該系列的產(chǎn)品是采用14x9mm封裝的ROM1490X，隨后將于2024年年中推出7x5mm貼片晶振產(chǎn)品。Rakon已經(jīng)在研究Mercury芯片的下一代產(chǎn)品，新的ASIC將于2025年發(fā)布，以進(jìn)一步提高性能。
ROM1490X進(jìn)口有源晶振是一款符合Stratum 3E標(biāo)準(zhǔn)的OCXO，在-40至95°C的擴(kuò)展工作溫度范圍內(nèi)提供±3 ppb的穩(wěn)定性。它專為數(shù)據(jù)中心同步、5G基站和小蜂窩、5G高級(jí)和6G無線電接入網(wǎng)絡(luò)（RAN）設(shè)計(jì)，是Rakon的款OCXO，它結(jié)合了其專有的Mercury™ASIC和XMEMS®諧振器技術(shù)，提供了更高的穩(wěn)定性和保持性能。
ROM1490X建立在Rakon在基于微型ASIC的OCXO、XMEMS®晶體諧振器、電路設(shè)計(jì)、熱封裝、高質(zhì)量制造工藝和高分辨率測(cè)試方法方面的專業(yè)知識(shí)之上。占地面積尺寸為14x9mm的小型OCXO石英晶體振蕩器實(shí)現(xiàn)了8小時(shí)的相位保持（1.5µs）。它提供0.05ppb/°C的低頻斜率，并保證20年內(nèi)±2.5ppm的長(zhǎng)期穩(wěn)定性。
ROM1490X配備了熱保護(hù)封裝，可以承受越來越高的低溫和強(qiáng)勁的氣流，同時(shí)保持可靠的頻率信號(hào)和定時(shí)同步。ROM1490X超過了Stratum 3E±5ppb的要求，并提供≤±3ppb的高級(jí)穩(wěn)定性，在性能和可靠性方面成為要求苛刻的電信應(yīng)用的。
ROM1490X恒溫晶振的主要性能參數(shù)：封裝：14.2x9.2x6.5毫米，6焊盤貼片頻率：10至50MHz工作溫度：- 40至95℃頻率穩(wěn)定性（FvT）：1.5ppb延期：8小時(shí)頻率斜率（δF/δT）：0.05ppb/℃老化：0.2ppb/天重力敏感度：0.9ppb/g定制的MercuryX產(chǎn)品通過的I C總線數(shù)字控制、GNSS 1PPS輸入和/或機(jī)器學(xué)習(xí)進(jìn)一步優(yōu)化了長(zhǎng)期穩(wěn)定性。
Rakon推出了集成電路OCXO產(chǎn)品ROM1490X
Rakon launches Small Form Factor IC-OCXO with 8hr holdover for cloud data centres and next-generation telecom networksRakon has launched its first IC-OCXO products combining its in-house designed Mercury™ semiconductor chip and XMEMS® resonators under the brａnd MercuryX™. MercuryX OCXOs provide ultra-high stability and an extended holdover of 8 hours. in real-world conditions, all in a small form factor package size. The new OCXOs are an excellent fit for timing and synchronisation in AI computing / data centres and 5G, 5G Advanced and 6G telecommunications networks as well as satellite terminals and instrumentation.Reza Sedehi, Head of Product Management at Rakon says: “The MercuryX products showcase the performance gains that are possible with next-generation quartz technology such as XMEMS. The initial 1000+ samples of MercuryX have generated high interest and positive feedback from tier-1 customers. The new products build on Rakon’s successful track record of consistently delivering high-quality ASIC based OCXOs (IC-OCXOs) in large volumes for over a decade.”MercuryX follows the launch of Niku™, Rakon’s latest in-house designed ASIC semiconductor chip for Ultra Stable TCXOs, as the next entry in the company’s AI computing product portfolio.The new MercuryX OCXOs offer a three-fold performance improvement on the current IC-OCXO range in terms of stability (±1.5 ppb), frequency slope (0.05 ppb/°C) and ageing (0.2 ppb/day). Even more importantly, MercuryX satisfies the much sought-after holdover requirements (8 hrs) for data centres and advanced telecom networks.The development of its own in-house resonator and chip technology allows Rakon to control its product roadmap, creating market-leading products like MercuryX that are independently manufactured in its factories in New Zealａnd and India, providing customers with high security of supply.The first product in the range is the ROM1490X in a 14 x 9 mm package, to be followed by a 7 x 5 mm product in mid 2024. Rakon is already working on the next iteration of the Mercury chip, with a new ASIC to be released in 2025 for further performance gains.Key performance parameters of the ROM1490X:Package: 14.2 x 9.2 x 6.5 mm, 6-pad, SMDFrequency (Fn): 10 to 50 MHzOperating temperature: - 40 to 95°CFrequency stability (FvT): ±1.5 ppbHoldover: 8 hrsFrequency slope (ΔF/ΔT): 0.05 ppb/°CAgeing: 0.2 ppb/dayG-sensitivity: 0.9 ppb/gCustom MercuryX products with further optimised long-term stability through advanced I²C bus digital control, GNSS 1PPS input and/or machine learning are available on request.
網(wǎng)站客服
